Two-Component Epoxy Potting Adhesive Low Heat Release for Packaging Protection of Motors

Two-Component Epoxy Potting Adhesive Low Heat Release for Packaging Protection of Motors. High Thermal Conductivity: Available in 1.0 W/m.k (SE685) and 1.5 W/m.k (SE686) options for efficient heat dissipation. UL 94 V-0 Flame Retardant: Meets UL 94 V-0 flame retardant grade standards for enhanced safety in electronic applications. Room Temperature Curing: Two-component epoxy adhesive that cures at room temperature or with heating, ensuring convenience. Low Shrinkage & Heat Release: Features low heat release during curing and minimal shrinkage to protect sensitive components. Strong Adhesion: Offers excellent adhesion and temperature resistance to most plastic and metal substrates. Weatherability & Durability: Resistant to moisture, waterproof, and maintains mechanical properties in harsh environments. Customization Available: Supports OEM/ODM services and customization from samples or designs for specific needs.