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Low Viscosity Flexible Epoxy Encapsulant Adhesive for Micro Electronic Component Potting
5.0InStock Source-listed auditby Zhengzhou Huayu Technology Co., Ltd
₹209≈ $2.5 · indicative, confirm with supplier
Description
Low Viscosity Flexible Epoxy Encapsulant Adhesive for Micro Electronic Component Potting, Find Details and Price about Low Viscosity Encapsulant Adhesive and Micro Component Potting Glue from Zhengzhou Huayu Technology Co., Ltd.
Specifications
ColorBlack
Model NO.HY484L
ApplicationElectronic Epoxy Resin
CustomizationAvailable
Bonding FunctionPotting and Encapsulation
