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Semiconductor High-Precision Die Attch Provide Flexible Packaging Capabilities for Advanced Packaging
InStock Source-listed auditby Suzhou Bozhon Semiconductor Co., Ltd
₹83,50,000≈ $100,000 · indicative, confirm with supplier
Supplier information
Description
Semiconductor High-Precision Die Attch Provide Flexible Packaging Capabilities for Advanced Packaging, Find Details and Price about Die Bonder and Die Bonding from Suzhou Bozhon Semiconductor Co., Ltd.
Specifications
SpeedHigh Speed
ConditionNew
Model NO.EH8621
PrecisionHigh Precision
After-sales Service7*24 Hour After-Sales Service
