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Semiconductor Silicon Wafer Thinning Equipment
5.0InStock Source-listed auditby Nanjing Bangwin Thermal Equipment Co., Ltd.
₹5,42,750≈ $6,500 · indicative, confirm with supplier
Payment
LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Incoterms
FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
Description
Semiconductor Silicon Wafer Thinning Equipment, Find Details and Price about Double Side Lapping Machine and Double Side Grinding Machine from Nanjing Bangwin Thermal Equipment Co., Ltd.
Specifications
TypeDouble Side Lapping Machine
Warranty1 Year
Model NO.bw
CustomizationAvailable
After-sales ServiceAvailable
