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High Efficiency Thermal Gap Filler Pad for Electronics Cooling
5.0InStock Source-listed auditby Xiamen Aibeisen Electronic Co., Ltd.
₹8≈ $0.1 · indicative, confirm with supplier
Payment
LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Incoterms
FOB, CIF, CFR, EXW
Description
High Efficiency Thermal Gap Filler Pad for Electronics Cooling. High Thermal Conductivity: 11 W/m.k thermal conductivity ensures efficient heat transfer for electronics cooling. Flame Retardant: Achieves UL-94 V0 flame rating for enhanced safety in electronic applications. Customizable Color: Available in Gray or customized colors to meet specific design requirements. Flexible Thickness: Thickness ranges from 0.5mm to 10.0mm to fill various gap sizes. High Tensile Strength: Tensile strength exceeds 10N, ensuring durability and mechanical stability. OEM/ODM Services: Offers full customization, minor customization, and flexible customization options. Fast Lead Time: Average lead time within 15 workdays for both peak and off-peak seasons.
Specifications
ColorGray
MaterialSilicone Material
Model NO.APS25039
ApplicationElectrical Power System, Electronic Communication, Electronic Device, Industrial Equipment, Medical Equipment, Transportation, Electric Devices
CustomizationAvailable
