High-Performance Thermally Conductive PU Potting Adhesive: Solving Heat Dissipation and Insulation Challenges in Electronic Sensors

High-Performance Thermally Conductive PU Potting Adhesive: Solving Heat Dissipation and Insulation Challenges in Electronic Sensors. High Thermal Conductivity: Thermal conductivity reaches 0.55 W/m.K for efficient heat dissipation in electronic sensors. UL-94 V-0 Flame Retardant: Contains flame retardant additives meeting UL-94 V-0 standard for enhanced safety. Solvent-Free Composition: Two-component polyurethane resin with no measurable volume change after curing. Low Water Absorption: Ensures long-term stability and insulation performance in humid conditions.