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Silicon Wafer Edge Profiling Equipment for Semiconductor Wafer
5.0InStock Source-listed auditby Nanjing Bangwin Thermal Equipment Co., Ltd.
₹5,84,500≈ $7,000 · indicative, confirm with supplier
Payment
L/C, T/T, D/P, Western Union, Paypal, Money Gram
Port
Shanghai, China
Incoterms
FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
Description
Silicon Wafer Edge Profiling Equipment for Semiconductor Wafer, Find Details and Price about Wafer Edge Profiling Machine IC Wafer Edge Grinding Machine from Silicon Wafer Edge Profiling Equipment for Semiconductor Wafer - Nanjing Bangwin Thermal Equipment Co., Ltd.
Specifications
StyleDesktop
OriginChina
AutomaticAutomatic
Model NO.bw
TrademarkN/A
Power (Kw)2
Weight (Kg)350
Package Size100.00cm * 100.00cm * 100.00cm
CertificationGS, CE, ISO
Specification1560x700x940mm
Adhesion ForceBetter Than -80kpa
Grinding Speed1mm/S-50mm/S
