Durable Glass Transport Carriers for Safe Handling Solutions

Durable Glass Transport Carriers for Safe Handling Solutions. Tunable CTE and Properties: CTE ranges from 3.4 to 9.0 x10-6/C with adjustable mechanical properties for semiconductor processes. Scalable Form Factors: Available in wafer (100-450mm) and panel (up to 600x600mm) formats with customizable thickness. Optical Transparency: Enables UV/IR debonding and laser marking serialization with low TTV and warp. High Chemical Durability: Excellent resistance to semiconductor process environments ensures long-term stability. Custom Surface Marking: Offers semi-standard or custom Surface ID marking options for traceability. Precise Edge Control: Features customizable edge beveling radius and chamfer types for specific handling needs. Low Surface Roughness: Surface roughness is maintained below 1.0nm for high-quality wafer handling. OEM/ODM Support: Full customization available from designs, supported by dedicated R&D engineers.