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One-Component High Modulus Sealant Prepared Based on Ms Resin for for Bonding and Sealing of Buses
5.0InStock Source-listed auditby Shanghai Sepna Chemical Technology Co., Ltd.
₹125≈ $1.5 · indicative, confirm with supplier
Description
One-Component High Modulus Sealant Prepared Based on Ms Resin for for Bonding and Sealing of Buses, Find Details and Price about Ms Adhesive Ms Polymer from One-Component High Modulus Sealant Prepared Based on Ms Resin for for Bonding and Sealing of Buses - Shanghai Sepna Chemical Technology Co., Ltd.
Specifications
OriginChina
HS Code3506100090
PurposeAll Purpose
MaterialPolyurethane
AdvantageHigh Strength
ComponentOne Component
Model NO.MS137
SubstrateMetal, Wood. Plastic, Concrete
TrademarkSEPNA
CompositionMs Polymer
Specification600ml/sausage; 310ml/tube
CharacteristicWaterproof
