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CategoriesManufacturing & Processing MachineryAssembly Line & Production LineOther Assembly Line & Production LineHigh Precision Cutting Machine for Semiconductor Wafer

High Precision Cutting Machine for Semiconductor Wafer

High Precision Cutting Machine for Semiconductor Wafer

InStock Source-listed auditby WUHAN SUNIC INTERNATIONAL TRADING CO., LTD.

₹10,02,000≈ $12,000 · indicative, confirm with supplier

Supplier information

Laser Cutting Machine Manufacturer, Laser Marking Machine, Laser Engraving Machine Supplier - WUHAN SUNIC INTERNATIONAL TRADING CO., LTD.

Manufacturer/Factory

Audited supplier

Description

High Precision Cutting Machine for Semiconductor Wafer, Find Details and Price about Laser Scribing Fiber Laser Scriber from High Precision Cutting Machine for Semiconductor Wafer - WUHAN SUNIC INTERNATIONAL TRADING CO., LTD.

Specifications

LaserFiber Laser

MotorServo Motor

OriginChina

RhythmFlow Production Line

HS Code8486402900

Footprint1175*845*1485mm

Model NO.SFM20/SFM30/SFM50

TrademarkARGUS

AutomationAutomation

IndustriesSolar Industries

Solar CellSolar Wafer

Work TableT-Model Ball Screw Transmission

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Application

Industrial

CertificationISO, CE

Specification210*210mm or 350*350mm

Cooling SystemAir Cooling

Production ScopeParts Production Line

Applicable FieldsPoly-Crystalline Silicon;Mono-Crystallion Silicon

Consumption PartsNo Need

Fiber Laser Power20W

Max Working Hours24 Hrs/7days

Power Consumption1kVA

Transmission TypeFlexible

Transport PackageExport Standard Wooden Case

Max Scribing Speed200mm/S

Flexible ProductionIntelligent Manufacturing

Standard Module DesignStandard Module Design

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High Precision Cutting Machine for Semiconductor Wafer | Made For Indians