High-Density IC Leadfream Developing/ Etching/Film Removal Equipment

High-Density IC Leadfream Developing/ Etching/Film Removal Equipment. CPVC Etching Cylinder: Made of CPVC material resistant to high temperature and corrosion. Patented Nozzle Design: All PVDF material nozzles with patented design for easy disassembly. LED Observation System: Etching groove equipped with LED lighting and built-in observation window. Automatic Chemical Control: Automatically controls addition of HCL, NaClO3, H2O for solution stability. High Speed Operation: Operating speed ranges from 2 to 4 meters per minute. One Year Warranty: Includes one-year warranty with 24/7 telephone remote support. Flexible Loading Options: Supports Strip to Strip, Roll to Roll, and Roll to Chip unloading methods.