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Buried-Via Microvia Multilayer Durable High-Frequency Fast-Turn Precision Any-Layer Ultra-Thin High-Density Interconnect PCB
5.0InStock Source-listed auditby SINING TECHNOLOGY (SHENZHEN) CO., LTD
Description
Buried-Via Microvia Multilayer Durable High-Frequency Fast-Turn Precision Any-Layer Ultra-Thin High-Density Interconnect PCB, Find Details and Price about High-Density Interconnect PCB High-Frequency PCB from Buried-Via Microvia Multilayer Durable High-Frequency Fast-Turn Precision Any-Layer Ultra-Thin High-Density Interconnect PCB - SINING TECHNOLOGY (SHENZHEN) CO., LTD
Specifications
BrandCustomized
OriginChina
HS Code8413910000
MaterialComplex
Lead Time10 days (1 - 1000 Pieces) 20 days (1001 - 10000 Pieces) To be negotiated ( > 10000 Pieces)
Model NO.SNT-HDI PCB-0248
TrademarkSNTPCB
ApplicationConsumer Electronics
Low-Loss DfLess Than 0.005%
Package Size30.00cm * 50.00cm * 30.00cm
Base MaterialCopper
SpecificationCustomized OEM
