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Hn-TCP-1000 10W/M. K Thermal Pad 120*120 Silicone Thermal Pad for CPU GPU Heatsink Cooling Premium Thermal Conductive Pad. Low viscosity,thermal conductivity ,0.8~12w/m.k,thickness 0.1~18mm.Can absorb 0.2mm structural tolerance to reduce processing costs for diverse application scenariosood. Highly compressible, soft & elastic; natural tackiness, no extra adhesive needed. Durable & reliable.