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RS-2 Fast Intelligent Fast Module Surface Mount Technology SMT Placement Machine. High-Speed Placement: Achieves 50,000 CPH with advanced TAKUMI head and laser technology. Laser Recognition: Enables fast, accurate identification of BGA, SOP, and QFP components. Wide Component Range: Handles components from 03015 to 50 mm square sizes. Flexible Production: Supports optimal line balancing and connects multiple units for capacity. CE Certified: Meets international safety and quality standards. 12-Month Warranty: Comprehensive coverage for one year after purchase. OEM/ODM Support: Offers full, minor, and flexible customization from designs or samples. New Condition: Brand new automatic grade high-speed chip mounter.