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Low Thermal Conductivity Polyether Polyol Rigid Foam Insulation Board
5.0InStock Source-listed auditby Hebei Shengxiao Import and Export Trading Co., Ltd
₹1,67,000≈ $2,000 · indicative, confirm with supplier
Payment
LC, T/T, D/P, PayPal
Incoterms
FOB, EXW, CFR, CIF
Description
Low Thermal Conductivity Polyether Polyol Rigid Foam Insulation Board. Ultra-low thermal conductivity, excellent long-term energy-saving performance. Superior dimensional stability, no cracking under extreme temperature. Low water absorption, hydrolysis-resistant for damp working environments. Balanced reactivity, good fluidity, boosts panel production efficiency. Easy to formulate flame retardant grade, eco-friendly fluorine-free formula.
Specifications
EINECS9016-87-9
CAS No.9003-11-6
FormulaCH2-Chcl-]N
Model NO.TS-4110 H
CustomizationAvailable
