Direct Copper Bonding On Metalized Electronic Ceramics Plate For Power Module Substrates

Direct Copper Bonding On Metalized Electronic Ceramics Plate For Power Module Substrates. High Thermal Conductivity: AlN substrate offers thermal conductivity exceeding 180W/m.K for efficient heat dissipation. Low Dielectric Loss: Ensures excellent insulation and high performance for high-frequency electronic applications. Custom Engineering Solutions: Available services include laser cutting, lapping, polishing, and metallizing based on design. Wide Application Range: Ideal for power modules, LED, IC products, microwave devices, and high-power transistors. ISO 9000 Certified Quality: Manufactured under international quality systems with advanced technology and scientific checks. Free Sample Availability: Free samples provided for testing purposes before placing official orders. Full Customization Options: Supports full customization from samples and designs to meet specific customer requirements. Global Market Presence: Serving customers in over 15 years across North America, Europe, Asia, and other regions.