Efficient SMT BGA Rework Station for Customizable PCB Repair Tasks

Description

Efficient SMT BGA Rework Station for Customizable PCB Repair Tasks. 8-Axis Independent Linkage: Features independent 8-axis linkage for precise and flexible PCB rework operations. Triple Heating Method: Combines top hot air, bottom hot air, and bottom infrared preheating for uniform heating. Full-Automatic Alignment: Equipped with high-definition industrial camera for precise full-automatic chip alignment. Wide Chip Compatibility: Supports BGA, POP, CCGA, QFN, CSP, LGA, and other complex chip types. Flexible Customization: Offers full, minor, and flexible customization options based on samples or designs. Advanced Control System: Integrates industrial all-in-one PC, PLC, and touchscreen for efficient operation. Nitrogen Interface: Includes available nitrogen interface to enhance soldering quality and reduce oxidation. High Precision Temperature Control: Features 10 heating/cooling segments and 10 constant temperature segments for accuracy.