Rigid Hard Gold 30u PCB Board, High Density Interconnect PCB Board

Rigid Hard Gold 30u PCB Board, High Density Interconnect PCB Board. High-Density Interconnect: Supports 0.2mm line width/space and 0.2mm min hole diameter for complex designs. Wide Layer Range: Capable of producing 1 to 20 layers, including blind and buried vias. Strict Quality Control: Adheres to IPC Class 2 & 3 standards with 100% electrical testing. Multiple Surface Finishes: Offers ENIG, OSP, HASL, Immersion Gold/Silver/Tin, and Gold fingers. Large Scale Production: Factory covers 60,000 sqm with 1,100 employees for prototype to batch. Comprehensive Certifications: Certified with ISO9001, ISO14001, UL, and IATF16949. Advanced PCBA Capacity: Handles BGA, 0201 chips, and large parts with precision assembly. Customizable Options: Allows customization of copper thickness, solder mask color, and silkscreen.