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1-8layers Three Models Smart Mobile Phone PCB Board with Enig
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Description
Model NO.: MP-03 Structure: Multilayer Rigid PCB Dielectric: FR-4 Application: Smart Mobile Phone Flame Retardant Properties: V0 Base Material: Copper
Specifications
Layer8layer
OriginChina
HS Code850110999
Model NO.MP-03
StructureMultilayer Rigid PCB
DielectricFR-4
ApplicationSmart Mobile Phone
CertificateUL& RoHS
Base MaterialCopper
Min Hole SizeLaser Hole 0.1mm, Through-Hole 0.25mm
Board Thickness1.6mm+/-0.1mm
Copper Thickness1oz
