Silicon Wafer Grinding Equipment for Semiconductor Factory

Silicon Wafer Grinding Equipment for Semiconductor Factory. AC Variable Frequency Drive: Ensures smooth and reliable operation with soft start and soft stop capabilities. Four Pressure Levels: Offers light, medium, heavy, and finishing pressure options for versatile grinding. Precise Control System: Motor speed and running time are directly inputtable on the control panel. Adjustable Grinding Disc: Freely raised and lowered with manual adjustment for excellent stability. Anti-Breakage Design: Separate slow-descent cylinder prevents breakage of thin and brittle workpieces. Electronic Counter: Accurately controls grinding revolutions and desired results. Diamond Dressing Capability: Supports diamond dressing wheels for disc maintenance. Rigid Drive Shaft: Large-size design eliminates vibrations caused by insufficient rigidity.