Bond Tester for Chips and Semi-Conductor Industries Gold Wire Tension and Gold Ball Thrust Testing Machine Lab Testing

Bond Tester for Chips and Semi-Conductor Industries Gold Wire Tension and Gold Ball Thrust Testing Machine Lab Testing. High Precision Testing: 0.1% accuracy with imported precision sensors and 32-bit AD converter for stable results. Multi-Module Flexibility: Automatically rotates and converts between tensile, small thrust, and large thrust tests. Advanced Control System: Features three closed loops: load, displacement, and speed for precise operation. Comprehensive Safety: Independent anti-collision overload protection for each sensor prevents precision deviation. Wide Application Scope: Used for chip, LED, smart card, and automotive electronics packaging testing. Customizable Ranges: Tensile (100g-20kg) and thrust (250g-100kg) ranges are customizable to specific needs. Professional Software: Windows-based software displays waveforms, histograms, and data reports easily.