Silicon Wafer Cleaning Machine for Semiconductor Fab. Multi-stage Cleaning Process: Removes micron particles, metal ions, and organic matter using ultrasonic, acid, alkaline, and rinsing steps. Automated PLC Control: Flexible adjustment of temperature, time, and power for monocrystalline and polycrystalline silicon materials. Energy-Saving Design: Overflow circulation filtration reduces water consumption and uses water-based agents instead of solvents. Dual Frequency Options: Available in 28kHz and 40kHz ultrasonic cleaning frequencies. Flexible Capacity: Supports processing volumes ranging from 38ml to 1500ml. 1-Year Warranty: Comprehensive coverage for mechanical defects and parts for one year. Fast Lead Time: Production completed within 15 workdays during both peak and off-peak seasons.