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Folded Spring Clip for Glass Substrate Holding Carrier System. C17200 beryllium copper / SUS301 stainless steel folded forming, stable elasticity, excellent electrical and thermal conductivity, designed for panel PVD/CVD carrier glass substrate clamping. Gold plating / nickel plating / bare finish, three surface treatments to meet different vacuum chamber process environments and anti-oxidation needs. CNC precision stamping and bending, consistent elastic deformation, customizable profile and hole positions, compatible with various CF/Array Carriers.