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High-Density Power Module Board with Gold Finger Edge for Server Memory Module
5.0InStock Source-listed auditby Shenzhen Sunwin Electronic Technology Co., Ltd
₹42≈ $0.5 · indicative, confirm with supplier
Payment
Description
High-Density Power Module Board with Gold Finger Edge for Server Memory Module, Find Details and Price about High Density Power Module Board Gold Finger Edge Board from High-Density Power Module Board with Gold Finger Edge for Server Memory Module - Shenzhen Sunwin Electronic Technology Co., Ltd
Specifications
Layers1-36layers
OriginChina
HS Code8534009000
PackageCarton
MaterialComplex
ConditionNew
Model NO.sw-119-3
TrademarkOEM
CustomizedCustomized
InspectionAoi,Spi,X-ray,Ict&Fct
Package Size10.00cm * 10.00cm * 10.00cm
TraceabilityFull Barcode/Mes System(Component,Batch,Porcess)
