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Ceramic Bond Diamond Grinding Plate for Aluminum Alloy, Copper Alloy.
4.0InStock Source-listed auditby Henan Ruiyan Diamond Technology Co., Ltd
₹3,75,750≈ $4,500 · indicative, confirm with supplier
Payment
L/C, T/T, D/P, Western Union, Paypal, Money Gram
Port
Qingdao, China
Incoterms
FOB, CIF, CFR
Description
Ceramic Bond Diamond Grinding Plate for Aluminum Alloy, Copper Alloy., Find Details and Price about High Precision Grinding Disc Diamond Grinding Plate from Ceramic Bond Diamond Grinding Plate for Aluminum Alloy, Copper Alloy. - Henan Ruiyan Diamond Technology Co., Ltd
Specifications
MOQ1 Piece
Grit80-4000
SizeCustomization
ShapeRound Disc
OriginChina
BondingCeramic
HS Code68042100
StandardCustomization
Warranty3 Years
Lead Time15days
Model NO.RY-CBD-X-01
TrademarkRuiyan
Application
