300 Degree Insulation Board Mold Semiconductor Insulation Board

300 Degree Insulation Board Mold Semiconductor Insulation Board. Better insulation performance than traditional refractory materials, effectively reducing furnace heat loss and operation cost. Full series of 1050/ 1260 / 1360 / 1430 elsius grades, suitable for various long-term high-temperature working conditions. Vacuum forming technology ensures compact structure, high hardness, anti-scouring and non-pulverization, longer service life. Stable structure under rapid heating and cooling, effectively avoid lining cracking and falling off. Support cutting, drilling, grooving and grinding, suitable for special shapes, save construction time. Much lighter than fire bricks, reduce overall furnace load and improve equipment safety. Asbestos-free and harmless, fireproof and sound-absorbing, meet international export standards. Smooth surface and uniform thickness, standard sheets & custom cut sizes are available.