Integrated Circuit Lead Frame Tin Plating Equipment Series

Integrated Circuit Lead Frame Tin Plating Equipment Series. Integrated Automatic Production: Achieves electrolytic softening, high-pressure water jet, high-speed tin plating, and blanking in one line. High-Speed Tin Plating: Operating speed ranges from 3 to 12 meters per minute for efficient production. Premium Component Brands: Equipped with OMRON, SMC, AirTAC, Panasonic, and Italian Inte pumps for reliability. Corrosion Resistant Materials: Features 316 Stainless Steel tanks and SIMONA PP pipelines for durability. Flexible Customization: Offers full customization, minor customization, and flexible options based on samples or designs. One-Year Warranty Coverage: Includes 24/7 telephone remote support and professional engineer follow-up for problem resolution. Wide Application Range: Suitable for IC lead frames with widths of 20-110mm and thicknesses of 1-12mm. Professional Manufacturer: Direct manufacturer with 50 R&D engineers and a dedicated research and production team.