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Low-Temperature Curing One-Component Epoxy Adhesives Are Used in The Underfilling Process of Chip Packaging
5.0InStock Source-listed auditby Shanghai Beginor New Material Co., Ltd.
₹501≈ $6 · indicative, confirm with supplier
Description
Low-Temperature Curing One-Component Epoxy Adhesives Are Used in The Underfilling Process of Chip Packaging. One-Component Formula: Solvent-free black epoxy adhesive with excellent flowability and workability. UL 94 V-0 Flammability Rating: Meets strict safety standards for fire resistance in electronic applications. Flexible Customization: Offers OEM/ODM services and flexible customization options for specific needs. ISO Certified Quality: Backed by ISO 9001 and ISO 14001 certifications for quality and environmental management.
Specifications
Model NO.BEEP 622
ApplicationAutomobile, Construction, Fiber & Garment, Footwear & Leather, Packing, Woodworking
CompositionOrganic Material
CustomizationAvailable
Bonding FunctionLiquid Sealing Leak
