Two-Component Thermal Conductivity Flame Retardant Automotive Electronics Epoxy Potting Encapsulant

Two-Component Thermal Conductivity Flame Retardant Automotive Electronics Epoxy Potting Encapsulant. two-component solvent free room temperature curing epoxy potting-sealing material. The colloidal toughness of the cured material is good, and the bending resistance is outstanding. The product meets the flame retardant grade of UL 94 V-0, which is suitable for the packaging and protection of the products with thermal conductivity requirements. Good toughness and high hardness Excellent adhesion and cracking resistance Excellent electrical insulation and stability. Good waterproof, moisture-proof, water absorption is very low Good temperature resistance, short time temperature resistance of 150 degrees. Suitable used for motors, automotive electronics, power tools, reactors and meters. And most of the plastic and metal substrate has excellent adhesion and temperature resistance.