Hermetic Flat Package with Leadframe Array for Micro Electronics

Hermetic Flat Package with Leadframe Array for Micro Electronics. Manufactured using precise ceramic metallization and vacuum brazing, delivering superior hermetic sealing to effectively protect internal chips from moisture and oxidation. Built with high-purity alumina ceramic rings that offer exceptional dielectric strength, withstanding high-voltage breakdown and ensuring reliable electrical isolation. Integrated with OFHC copper or Kovar metals to match the Coefficient of Thermal Expansion (CTE) with ceramics, reducing thermal stress and ensuring rapid heat dissipation.