Loading…
Semiconductor Silicon Wafer Double Side Polishing Machine. High Precision Control: Adopts PLC/grating ruler/servo control for fully closed-loop thickness control. Integrated Processing: Achieves integrated rough grinding and fine grinding in one equipment. Stable Operation: Features high processing precision and stable operation performance. Complete Line Solution: Can build a complete silicon wafer production line. Certified Quality: Certified by GS, CE, RoHS, and ISO 9001 standards. Fast Lead Time: Average lead time within 15 workdays for both peak and off seasons. 1-Year Warranty: Provides 1-year warranty coverage for the machine. Global Support: After-sales service available with support for major global markets.