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S855 Heat-Curing Adhesive and Sealant Based on Flexible Epoxy Resin for in Combination with Spot Welding
5.0InStock Source-listed auditby Shanghai Sepna Chemical Technology Co., Ltd.
₹417≈ $4.99 · indicative, confirm with supplier
Description
S855 Heat-Curing Adhesive and Sealant Based on Flexible Epoxy Resin for in Combination with Spot Welding, Find Details and Price about Sealant for Teel or Electrophoretic Plates High Temperature Sealant from S855 Heat-Curing Adhesive and Sealant Based on Flexible Epoxy Resin for in Combination with Spot Welding - Shanghai Sepna Chemical Technology Co., Ltd.
Specifications
ColorWhite
Einecs210-898-8
OriginShanghai, China
CAS No.9009-54-5
MaterialEpoxy
Model NO.S855
TrademarkSEPNA
MorphologySolid-State
CompositionEpoxy Resin
Specification400ml/cartridge, 20 cartridge/ box 230kg/ bucket.
CharacteristicSealing, Waterproof, Dustproof and Anti-Corrosion
ClassificationHigh Temperature Curing Sealant
