High Precision Industrial Grade Data Center Motherboard PCB Assembly

High Precision Industrial Grade Data Center Motherboard PCB Assembly. Massive Assembly Capacity: SMT: 30 million points/day; DIP: 100,000 pieces/day. Comprehensive Turnkey Service: PCB Design, FAB, Sourcing, Assembly, Box Building, and Packaging. Medical Grade Quality: IPC-A-610 Class 2/3 compliant with ISO 13485:2016 certification. Advanced Testing Capabilities: 3D SPI, 3D AOI, X-ray, Flying Probe, ICT, FCT, and Burn-in Test. No MOQ Restriction: Supports both prototype and volume production without minimum limits. Fast Turnaround Time: Prototypes in 5-10 days; Mass production in 15-25 days. Full Traceability System: Complete barcode/MES traceability for components, processes, and operators.