High Performance Thermal Conductive Pads Silicone SSD CPU Fpu LED Heatsink PC Cooling Pad. High Thermal Conductivity: Thermal conductivity ranges from 1.0 to 8.0 W/M.K for efficient heat dissipation. Customizable Thickness: Thickness can be customized from 0.3mm to 18mm to fill uneven size gaps. Strong Adhesive Bond: Features strong stickiness with glue, hard to fall off, and requires no fixed devices. Reusable and Easy Install: Easy to install and can be reused, replacing volatile and polluted thermal grease. Electrical Insulation: Provides good electrical insulation while maintaining high compress performance. Soft and Flexible: Soft and flexible material ensures good thermal conductivity and compress performance. RoHS and SGS Certified: Meets RoHS and SGS environmental requirements for safety and compliance. Wide Application Range: Suitable for communication equipment, computers, EVs, PCs, and various heating elements.