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Laser Dicing Saw for Semiconductor Wafer Cutting Machine
InStock Source-listed auditby WUHAN SUNIC INTERNATIONAL TRADING CO., LTD.
₹10,02,000≈ $12,000 · indicative, confirm with supplier
Supplier information
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Description
Laser Dicing Saw for Semiconductor Wafer Cutting Machine, Find Details and Price about Laser Scribing Fiber Laser Scriber from Laser Dicing Saw for Semiconductor Wafer Cutting Machine - WUHAN SUNIC INTERNATIONAL TRADING CO., LTD.
Specifications
LaserFiber Laser
MotorServo Motor
OriginChina
RhythmFlow Production Line
HS Code8486402900
Footprint1175*845*1485mm
Model NO.SFM20/SFM30/SFM50
TrademarkARGUS
AutomationAutomation
IndustriesSolar Industries
Solar CellSolar Wafer
Work TableT-Model Ball Screw Transmission
