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Servo Driven Wafer Stick Arranging and Flow Wrapping Machine
5.0InStock Source-listed auditby FOSHAN TEFUDE AUTOMATION SCIENCE & TECHNOLOGY CO., LTD.
₹2,92,250≈ $3,500 · indicative, confirm with supplier
Payment
LC, T/T, Western Union, PayPal
Incoterms
FOB, CIF, CFR, EXW
Description
Servo Driven Wafer Stick Arranging and Flow Wrapping Machine. Dual Splice Function: Reduces film exchange time with double film roll capability. High-Speed Operation: Packing speed ranges from 35 to 300 bags per minute. Servo Drive Control: Three servo driving system ensures high precision and stability. Flexible Customization: Supports full, minor, and design-based customization options. 1-Year Warranty: Includes 1-year warranty with lifelong service support.
Specifications
UsagePackaging of Goods, Packing
Warranty1 Year Warranty and Lifelong Service
Model NO.TFD-ZT300
CustomizationAvailable
After-sales Service1 Year Warranty and Lifelong Service
