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IC Silicon Wafer Edge Processing Machine High Accuracy
5.0InStock Source-listed auditby Nanjing Bangwin Thermal Equipment Co., Ltd.
₹5,84,500≈ $7,000 · indicative, confirm with supplier
Payment
LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Incoterms
FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
Description
IC Silicon Wafer Edge Processing Machine High Accuracy. Adjustable Grinding Speed: Grinding speed ranges from 1mm/S to 50mm/S with 0-4500rpm wheel speed. Versatile Wafer Compatibility: Processes various wafer sizes from 3 to 6 inches with different materials. Semi-Automatic Operation: Requires only manual loading and unloading while the machine handles grinding. Certified Safety Standards: Equipped with GS, CE, and ISO certifications for reliable operation. Complete Production Line: Capable of building a complete silicon wafer production line. 1 Year Warranty Coverage: Includes 1-year warranty with available after-sales service support. Compact Desktop Design: Desktop style with 350kg weight and 2KW power consumption.
Specifications
Warranty1 Year
AutomaticAutomatic
Model NO.bw
CustomizationAvailable
After-sales ServiceAvailable
